RF and High Speed Board Design: Fundamentals and Practice
Details
RF boards have gained a reputation for being mysterious. They require additional tuning, as simulation tools and models are unable to accurately deliver an operational board after fabrication during tuning. This course will introduce the techniques needed for RF and high-speed digital board design.
By building from a foundation of RF fundamentals, participants will be able to develop an understanding of both the components attached to the board and the interconnection between them. It is necessary to have thought through potential issues before embarking on the design and to have the right access on the board to debug such issues. Approaches to characterization, testing, and debug will be covered in the course, allowing the student to plan for board bring-up. Above all, any board design must go through a thorough design review process. Students successfully complete this course will be able to undertake all the stages of a successful board design and successful board bring-up.
Who Should Attend?
Engineers working with RF or high-speed digital printed circuit boards.
Design and layout engineers tasked with undertaking RF or high-speed digital board design.
Technicians and test engineers involved in test and debug using RF boards.
Technical management needing an understanding of RF or high-speed digital board design, debug and testing.
The course aims to impart an intuitive understanding of the concepts involved, but there is a mathematical basis to most of the content and the student will need to be comfortable dealing with engineering mathematics.
More Couse Dates:
07 - 09 Jun 2021
29 Nov - 01 Dec 2021
Copy the link to your browser for Course Brochure:
http://www.wizlogix.com/edm/RF&High-SpeedBoardDesign/
Training Grants Available! Email us at [email protected] or Call us at +65 6272 6366 for more information & registration!
Outline
Day 1
- RF Basics
- RF Circuits
- Passsive Components
- Interconnects
- EM simulation
Day2
- Terminations and matching
- Grounding issues
- Coupling and decoupling considerations
- Harmonics
- Crosstalk
Day 3
- Designing for tunability
- High speed digital
- Mixed-signal and analogue board design
- Practical tips for board design
- Design review checklist
- Debuging RF board issues
Key Concepts
RF board design, high-speed digital board design, RF fundamentals, frequency versus time domain, circuit and component modelling, interconnect modelling, board tuning, board characterization, board testing, common failure mechanisms, RF board debug approaches
Tools Used
During the course, the following tools will be used in several labs:
• Excel (Apache Open Office Calc or Google Sheets as alternatives)
Labs will be held daily so attendees will need to bring their own laptop computerfor every day of the course. The course will also include an overview of web resources for RF board design so participants will also find it useful to have their laptops for these sections as well.
Speaker/s
He was the inventor of the output structure used on all Amalfi/RFMD CMOS PAs and was also the sole inventor of the method used to integrate the front-end switching in bulk CMOS for the World's first GSM/GPRS Tx Modules with integrated switch. He was also the lead of the group that designed a Band I WCDMA amplifier with the World leading Figure Of Merit (FOM) for a CMOS PA of 80.
Prior to Amalfi Semiconductor, Dr. Smith worked at Intel where he was responsible for the architecture and system design of cellular transceivers and was involved in making the first call on a public network using an Intel designed transceiver. Dr. Smith started in the cellular field at Bell Labs in 1996 where he was delivered mixed-signal, analogue, and RFIC circuits for cellular and pager products.
Before Bell Labs and after graduating with a Ph.D. he worked for over three years at Matsushita Electric Works (now renamed Panasonic) in Osaka, Japan, on the design of analogue sensor circuits. He holds over 40 patents, has delivered invited tutorials at conferences in Asia, the US and Europe and has published several Journal and conference papers.
Dr. Smith was awarded the B.Sc (Hons) degree in Microelectronics from the University of Edinburgh, the M.Sc. from the University of Westminster and the Ph.D. Degree from the University of Kent all in the UK. He is a Senior Member of the IEEE and a Member of the IET in the UK.
Special Offer
Group Discount
A group discount will be awarded if a group of 3 or more participants register. The fees will be lowered to $2,500 per pax.
- In 2004, Wizlogix invested in high-end EDA tools to be used for in-house layout design services and explored into additional services such as PCB prototyping fabrication and assembly.
- In 2007, the Wizlogix Training Hub was established. Working with renowned trainers internationally, we aim to provide technical competency courses and certification programs for local engineers.
- In 2009, we further expanded to specialize in quick turn prototyping, New Product Introduction (NPI) and High Mix Low Volume (HMLV) builds.
- With the aim of expanding like an MNC, Wizlogix embarked on improving employee engagement through HR Capability Programmes in 2011.
- In 2012, we became an IPC member to gear ourselves towards a worldwide industry standard in PCB qualities acceptance.
- By 2013, Wizlogix was involved in the PCB layout of a joint commercial satellite design and development project between DSO and NTU, and the satellite design for Singapore Technologies. They are now known as ST (Satellite System). Since then, we became part of the space ecosystem in the government’s efforts towards nurturing this new industry. ...
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