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Thermal management refers to the control of heat in electronics circuits. Heat is an unavoidable by-product of every electronic device and circuitry and is usually detrimental to performance and reliability. The trend in packaging electronic systems has been to reduce size and increase performance, both of which contribute to heat generation and concentration. Higher levels of integrated functions in a smaller package has resulted in higher heat densities, thus giving rise to the importance of thermal management in maintaining system performance and reliability.

This course introduces the basic heat transfer fundamentals and some typical failure modes associated with different packaging levels. Various thermal cooling solutions will also be introduced and discussed based on their benefits and disadvantages. In the second portion, there will be a hands-on learning session on how to conduct heat transfer analysis using a commercial finite element analysis (FEA) software. FEA will allow the understanding of the heat flow paths in the package as well as the prediction of component temperatures. It further allows the virtual design and assessment of the cooling solutions before prototyping, which drastically reduces the design cycle time to production.

More Course Dates:
TBA

Copy the link to your browser for Course Brochure: 
http://www.wizlogix.com/edm/Thermal_Management/

Training Grants Available! Email us at [email protected] or Call us at +65 6272 6366 for more information & registration!

Outline

Introduction

  • Failure Modes 
  • Failure rate increases with temperature
  • Packaging Levels and Heat Removal

Electronic Cooling Methods

  • Heat Sinks
  • Heat transfer calculations for fins
  • Thermal vias
  • Cooling with heat pipes
  • Jet Impingement Cooling
  • Liquid Cooling
  • Thermoelectric Cooling

Finite Element Heat Transfer Simulation Workshop

  • Hands-on workshop with Abaqus

Who should attend?

R&D engineers, Thermal engineers, graduate students who wish to learn about packaging, FEA engineers new to microelectronics packaging,

 

Who would you learn?
Concept of thermal management, basics/fundamentals of heat transfer, thermal cooling solutions used in the IC packaging industry, FEA hands-on learning on heat transfer modeling

Speaker/s

Dr Long Bin, TAN

Senior Consultant Overview Interests in research pertaining to microelectronic reliability, solder characterization (mechanical and microstructural) and chip fabrication.

Interests in research pertaining to defence – with topics ranging from blast, ballistics, infrastructure reliability, acoustics, protection of personnel and infrastructure, new material development.

Adept in CAD modeling & simulation (Explicit, Standard, Heat Transfer – Transient/Steady State, Thermal Stress, Modal Analysis, Parametric Modeling, Modeling of Failure, Sub-Modeling, CFD, CEL, SPH, Adaptive Remeshing, Acoustics Analysis) of structures & materials. Interests in simulation techniques such as XFEM, FSI.

Experienced in Lab setup and management, various testing techniques, Material Characterization, Metallurgy and Failure Analysis Developed various full undergraduate modules and laboratory lessons, and also provided numerous technical courses as a trainer.

Special Offer

Group Discount

A group discount will be awarded if a group of 3 or more participants register. The fees will be lowered to $999 per pax.

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Wizlogix was founded by our Directors, Angeline Lee and Shawn Ng in year 2000. We were awarded with our first major contract in PCB layout design from HP (Hewlett Packard), and have developed long term business relations with them ever since.
  • In 2004, Wizlogix invested in high-end EDA tools to be used for in-house layout design services and explored into additional services such as PCB prototyping fabrication and assembly.
  • In 2007, the Wizlogix Training Hub was established. Working with renowned trainers internationally, we aim to provide technical competency courses and certification programs for local engineers.
  • In 2009, we further expanded to specialize in quick turn prototyping, New Product Introduction (NPI) and High Mix Low Volume (HMLV) builds.
  • With the aim of expanding like an MNC, Wizlogix embarked on improving employee engagement through HR Capability Programmes in 2011.
  • In 2012, we became an IPC member to gear ourselves towards a worldwide industry standard in PCB qualities acceptance.
  • By 2013, Wizlogix was involved in the PCB layout of a joint commercial satellite design and development project between DSO and NTU, and the satellite design for Singapore Technologies. They are now known as ST (Satellite System). Since then, we became part of the space ecosystem in the government’s efforts towards nurturing this new industry. ...
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