Details
This course covers the methodology of designing an electronic product to minimize the possibilities for electromagnetic interferences (EMI) and signal integrity (SI) problems. The techniques are useful specially for designers of high speed digital and analog circuits and radio frequency designers. The basics of designing electronic products with SI and EMI in mind are introduced in a very understandable and entertained style. The course has a very practical approach through real world examples, techniques, simulation and hardware demos.
EMI and SI in electronic circuits include a review of components in the high frequency and high speed domain. Typical EMI and SI related problems are discussed in a general perspective. Transmission lines and impedance matching are covered due to its importance
in the design of a robust system. Participants will also have a better understanding of grounding, filtering and the design techniques for printed circuit boards in high frequency and high speed systems. The longest elements in our design, the cables, will
be discussed. As the key element in the signal propagation and antenna effects of any electronic design, a general and intuitive explanation of antenna fundamentals have to be included for non-RF specialists in explaining about radiation and pick-up behaviour
of cables and hidden antennas. Instrumentation, measuring and troubleshooting techniques for EMI/SI problems are included.
Learning objectives
Upon completing the course you will be able to:
- understand the basics and fundamentals of EMI and SIGNAL INTEGRITY (SI) issues.
- look at the high frequency fundamentals of EMI/SI, modelling the problems to be able to propose solutions.
- locate and fix EMI/SI problems in a product or installation.
- design electronic equipment to avoid common EMI/SI failures.
- use lab measurements and tools to find or fix typical EMI/SI problems.
- reduce time and cost of EMI/SI diagnostic and fixes.
Target Audience
- Design engineers/technicians from the electronics industry involved in EMI and SIGNAL INTEGRITY (SI) problems.
- those interested in a working knowledge of EMI/SI engineering principles and concerned with EMI/SI problems as high speed digital designers, RF designers and PCB layout engineers.
- managers responsible for design, production, test and marketing of electronic products.
- marketing engineers who need a general and practical knowledge of the EMI/SI basics.
More Course Dates:
Upon Request
Copy the link to your browser for Course Brochure:
http://www.wizlogix.com/edm/SignalIntegrityandEMIFundamentals/
Training Grants Available! Email us at [email protected] or Call us at +65 6272 6366 for more information & registration!
Outline
• Electrical signals • Maxwell vs. Kirchhoff: limits of circuit theory • Decibel and logarithmic scales • Spectrum of a signal: time domain vs. frequency domain • Resonance • Quality factor (Q) both loaded and unloaded • Bandwidth • Impedance matching definition • Frequency vs. dimensions (size) • Time vs. distance • Scattering parameters (s-parameters) • Typical formats and how to measure them
High speed/frequency effects in electronic circuits: when a capacitor is an inductor
• High speed and RF effects: attenuation, gain, loss and distortion • Skin effect, return current and parasitic effects • The importance of rise time and fall times (dv/dt and di/dt) • Controlling signal return currents, differential vs. common mode currents • Introduction • Non ideal components • The "hidden schematic" concept - Resistors, capacitors and inductors - Ferrites - Transformers - Diodes - Transistors - ICs • Digital and high speed circuit key parameters - power, speed and package • Wires • Cables and connections basics • PCB structures (dielectric materials, structures, dissipation factor, the multi-layer structure idea) • Transmission lines basics • Lumped vs. distributed systems • Vias (effects and modelling in high frequency) • Shielding basics • Clocks
Transmission lines: controlling propagation
• Wiring and connecting components - limitations for high frequency and high speed systems • What is a transmission line? • Motivation: signal propagation • Modelling a transmission line - Characteristic impedance - Velocity of propagation • description of typical transmission lines - coax, pairs, microstrip and stripline • Reflection coefficient • Standing wave ratio (SWR, VSWR and ISWR) and Return loss • Intuitive explanation • Examples from real world
Matching: Avoiding reflections. Obtaining maximum power transfer
• Maximum transfer of power and avoiding reflections • Matching with LC components • Matching networks: L, PI and T networks • Matching in narrow and broadband networks • Matching with transformers • Matching with transmission lines • Terminations to avoid SI/EMI problems: solutions and techniques • Using software to design a matching network • Examples from real world
• What is Signal Integrity (SI) in electronic circuits? • undesired effects • Propagation time and delay • Reflections and ringing • Inductive vs. capacitive coupling - crosstalk (near and far) • Delays • Jitter • Ground bounce • Power supply noise • High frequency, dv/dt and di/dt
Grounding: the most important subject
• Signal ground vs. safety ground • Ground in high frequency/speed applications - low impedance path • Minimizing ground impedance • Common impedance • Ground strategies (single point, multipoint, and hybrid) • Ground loops
Filtering
• Basic ideas • Filters for known impedances (no EMI applications) • Basic design techniques with examples • Filters for EMI/EMC • How filters work: reflection vs. dissipation • Insertion losses • Source and load influence • Parasitic and location effects • Filtering with ferrites • Saturation and undesired coupling effects • Decoupling and bypass fundamentals • Damping resonances and ringing • Three terminal and feed through components
Printed Circuit Boards (PCBs)
• Basic ideas • Design strategy • Partitioning and critical zones • PCB structures - dielectric materials, structures, dissipation factor • Choosing the PCB structure: how many layers and distribution • Power planes design and distribution • Layout and routing (1, 2 and multilayer) techniques - traces - microstrip and stripline - corners - vias - controlling impedance for SI - transmission line effects and solutions • Ground planes • Splits or ground discontinuities in planes (slots) • Decoupling and bypass (how, where, resonances, etc): discrete capacitors vs. embedded techniques in high speed/RF designs • Crosstalk and guards • How ground plane layout affects crosstalk • Mixed signal PCBs (A/D designs) • Controlling clock waveform • Clock distribution • Clock shielding • Examples from real world
• Basic ideas for cable fundamentals • The control of return current • Types of cables (wires, twisted pairs, coax, shielded cables, ribbon cables, etc.) • Cable impedance • Shielded cables and cable grounding • Connectors • Parasitics in connectors for high speed signals • Avoiding crosstalk and reflections in cables (layout and terminations) • Avoiding common impedance in cables • Reducing emissions and pick-up in cables • Examples from real world
Measuring and Troubleshooting Techniques
• Antenna basics • How to measure EMI and SI effects - tools, instruments and techniques • Scope and probe limitations • Review of some typical errors in measurement techniques • Measuring high frequency current in electronic circuits • Diagnostic and troubleshooting techniques and hints • Locating EMI sources with near field probes
Speaker/s
Arturo Mediano received both his M.Sc. (1990) and his Ph. D. (1997) in Electrical Engineering from the University of Zaragoza, Spain. He has been involved in design and management responsibilities for R&D projects with companies in the radiofrequency (RF) and EMI/EMC fields for communications, industry and scientific/medical applications since 1990.
Since 1992 he has held a teaching professorship with special interest in Electromagnetic Interference and Electromagnetic Compatibility (EMI/EMC) and RF (HF/VHF/UHF) design for Telecom and Electrical Engineers.
His research interest is high efficiency switching mode RF power amplifiers with experience in applications like mobile communication radios, broadcasting, through-earth communication systems (TTE), induction heating, medical equipment, plasmas for industrial applications and RFID.
He has substantial experience in collaboration with industries with a focus on training and consulting in RF design and EMI/EMC design and troubleshooting.
He has taught more than 40 courses and seminars for industries and institutions in the fields of RF/EMI/EMC in Spain, USA, Switzerland, France, UK, Italy and The Netherlands. He is currently an instructor for Besser Associates.
He has been involved in approximately 50 R&D projects for companies and/or institutions in the fields of EMI/EMC/RF (in more than 40 projects as Main Researcher). Usually the result was directly used in a marketed product.
Dr. Mediano is author/co-author for around 50 publications and 8 patents as result of activity in research activities listed before.
He has been a speaker in paper sessions and tutorials of some of the most important symposiums and conferences related to RF and EMC (RF EXPO, IEEE IMS, and IEEE Intl. Symp. EMC, URSI, EPE, ARFTG, EUROEM, IEEE RWS, EuMW, etc).
He is a Senior Member of the IEEE, where he has been an active member since 1999 (Chair since Jan 2013) of the MTT-17 (HF/VHF/UHF technology) Technical Committee of the Microwave Theory and Techniques Society and member and currently Chair of the Electromagnetic Compatibility Society (member of the directive of the EMC Spanish Chapter).
Arturo shares free time between his family, fly fishing, and drawing cartoons.
Special Offer
Group Discount
A group discount will be awarded if a group of 3 or more participants register. The fees will be lowered to $3400 per pax.
- In 2004, Wizlogix invested in high-end EDA tools to be used for in-house layout design services and explored into additional services such as PCB prototyping fabrication and assembly.
- In 2007, the Wizlogix Training Hub was established. Working with renowned trainers internationally, we aim to provide technical competency courses and certification programs for local engineers.
- In 2009, we further expanded to specialize in quick turn prototyping, New Product Introduction (NPI) and High Mix Low Volume (HMLV) builds.
- With the aim of expanding like an MNC, Wizlogix embarked on improving employee engagement through HR Capability Programmes in 2011.
- In 2012, we became an IPC member to gear ourselves towards a worldwide industry standard in PCB qualities acceptance.
- By 2013, Wizlogix was involved in the PCB layout of a joint commercial satellite design and development project between DSO and NTU, and the satellite design for Singapore Technologies. They are now known as ST (Satellite System). Since then, we became part of the space ecosystem in the government’s efforts towards nurturing this new industry. ...
